Patent Number: 7,086,148

Title: Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Inventors: Bambridge; Timothy Brooks (Pittstown, NJ), Bowen; John Wayne (Warminster, PA), Brennan; John McKenna (Wyomissing, PA), Freund; Joseph Michael (Fogelsville, PA)

Assignee: Agere Systems Inc.

International Classification: H05K 3/00 (20060101)

Expiration Date: 8/08/02018