Patent Number: 7,087,315

Title: Method for forming plating film

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Inventors: Matsuo; Yoshihiko (Yamatotakada, JP), Ikeda; Ryukichi (Kitakyushu, JP), Yoshida; Kimihiko (Kiyakyushu, JP), Okuda; Fumio (Simonoseki, JP)

Assignee: Sharp Kabushiki Kaisha

International Classification: B32B 15/01 (20060101); C25D 5/48 (20060101)

Expiration Date: 8/08/02018