Patent Number: 7,087,451

Title: Microfabricated hot wire vacuum sensor

Abstract: A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure.

Inventors: Arana; Leonel R. (Phoenix, AZ), Zou; Yuelin Lee (Phoenix, AZ), Heck; John (Berkeley, CA)

Assignee: Intel Corporation

International Classification: H01L 21/00 (20060101); H01L 31/058 (20060101)

Expiration Date: 8/08/02018