Patent Number: 7,087,467

Title: Lead frame and production process thereof and production process of thermally conductive substrate

Abstract: A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture which comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.

Inventors: Yamashita; Yoshihisa (Kyoto, JP), Hirano; Koichi (Hirakata, JP), Nakatani; Seiichi (Hirakata, JP), Suzumura; Masaki (Hisai, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H01L 21/44 (20060101); H01L 21/48 (20060101); H01L 21/50 (20060101)

Expiration Date: 8/08/02018