Patent Number: 7,087,845

Title: Metal core multilayer printed wiring board

Abstract: The present invention is characterized in that in a metal-core multilayer printed wiring board (1) which is obtained by forming one or more of at least inner layers of a laminate having a insulating layer and a conductor layer stacked alternately from a metal plate and has the metal plate as a core, the metal plate (13) is disposed below a site on which a heating element (10) is to be mounted, a surface layer over which the heating element (10) is to be mounted is connected to the metal plate (13) of the inner layer via a BVH (12) and a heat radiation layer (14) is formed over the surface layer. The present invention makes it possible to efficiently radiate heat, which has been released from the heating element, to the outside of the printed wiring board without impairing the packaging density of circuits and at the same time, to mount another element on the side opposite to the side on which the heating element exists.

Inventors: Tohkairin; Hiroshi (Isesaki, JP), Sakakibara; Kenji (Kariya, JP), Kabune; Hideki (Chiryuu, JP)

Assignee: CMK Corporation

International Classification: H05K 1/00 (20060101)

Expiration Date: 8/08/02018