Patent Number: 7,087,989

Title: Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Abstract: A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.

Inventors: Nakayama; Toshinori (Nagano-ken, JP)

Assignee: Seiko Epson Corporation

International Classification: H01L 23/02 (20060101)

Expiration Date: 8/08/02018