Patent Number: 7,087,994

Title: Microelectronic devices including underfill apertures

Abstract: Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have a longer first dimension (62) and a shorter second dimension (64). In some embodiments, a method of filling the underfill gap (70) employs a removable stencil (80). If so desired, a stencil (80) can be used to fill multiple underfill gaps through multiple underfill apertures in a single pass.

Inventors: Lee; Teck Kheng (Singapore, SG)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/48 (20060101)

Expiration Date: 8/08/02018