Patent Number: 7,088,004

Title: Flip-chip device having conductive connectors

Abstract: Semiconductor devices having a passivation layer formed over their major electrodes and individual electrical connectors connected to the electrodes by conductive attach material through openings in the passivation layer are described.

Inventors: Standing; Martin (Tonbridge, GB)

Assignee: International Rectifier Corporation

International Classification: H01L 23/58 (20060101); H01L 23/52 (20060101); H01L 29/40 (20060101)

Expiration Date: 8/08/02018