Patent Number: 7,088,010

Title: Chip packaging compositions, packages and systems made therewith, and methods of making same

Abstract: A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system includes a packaging composition that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a chip package that uses an adamantoid packaging composition.

Inventors: Lim; Sheau Hooi (Penang, MY), Chee; Choong Kooi (Penang, MY)

Assignee: Intel Corporation

International Classification: H01L 23/14 (20060101); H01L 23/29 (20060101)

Expiration Date: 8/08/02018