Patent Number: 7,088,121

Title: Non-contact method and apparatus for on-line interconnect characterization in VLSI circuits

Abstract: A system that facilitates non-invasive in-line characterization of parameters of VLSI circuit interconnects is provided. A plurality of micro-electro-mechanical system (MEMS) cantilevers apply voltage(s) to VLSI circuit interconnect(s) without physical contact thereto. A measuring component measures deflection characteristics of the cantilevers, the deflection(s) correspond to electrical forces generated from the applied voltage(s) as passed through VLSI circuit interconnect(s). A component computes characteristics of the VLSI interconnect based at least in part upon the measured deflection characteristics.

Inventors: Arora; Narain D. (San Jose, CA), Pirogova; Rimma A. (San Jose, CA)

Assignee: Siprosys, Inc.

International Classification: G01R 31/26 (20060101)

Expiration Date: 8/08/02018