Patent Number: 7,088,204

Title: Transmission line and semiconductor integrated circuit device

Abstract: The transmission line is provided with a signal strip, a resistive layer opposed to the signal strip across a dielectric layer, and a ground conductor electrically connected to the resistive layer, wherein, in the case where resistance per unit length occurring when a high frequency current induced in the resistive layer through capacitance formed by the dielectric layer between the signal strip and the resistive layer flows in the resistive layer and between the resistive layer and the ground conductor at the time of transmission of a high frequency signal of a predetermine frequency through the signal strip is defined as additional resistance and resistance per unit length occurring when the high frequency current flows through the ground conductor is defined as ground resistance, the additional resistance is larger than the ground resistance.

Inventors: Kanno; Hiroshi (Osaka, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H01P 1/162 (20060101); H01P 1/26 (20060101)

Expiration Date: 8/08/02018