Patent Number: 7,088,559

Title: Integrated interconnect and method of manufacture therefor

Abstract: An integrated interface structure for a nested body to provide an electrical connection. The interface structure includes nested bond pads which electrically interface with leads. The nested bond pads are fabricated on a microstructure to provide an interface to drive circuitry for transducer elements of a slider or head supported by the microstructure.

Inventors: Hipwell, Jr.; Roger L. (Eden Prairie, MN), Bonin; Wayne A. (North Oak, MN), Crane; Peter (St. Paul, MN), Boutaghou; Zine-Eddine (Vadnais Heights, MN)

Assignee: Seagate Technology LLC

International Classification: G11B 5/56 (20060101)

Expiration Date: 8/08/02018