Patent Number: 7,088,586

Title: Techniques for cooling a circuit board component within an environment with little or no forced convection airflow

Abstract: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-a-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.

Inventors: Huynh; Hong (Fremont, CA), Narasimhan; Susheela (Milpitas, CA), Koken; Michael (Sunnyvale, CA)

Assignee: Cisco Technology, Inc.

International Classification: H05K 7/20 (20060101)

Expiration Date: 8/08/02018