Patent Number: 7,088,590

Title: Soldermask opening to prevent delamination

Abstract: A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing. The second openings expose selective regions of a conductor layer. The multi-layer circuit board provides for less occurrences of delamination.

Inventors: Rumsey; Brad D. (Meridian, ID)

Assignee: Micron Technology, Inc.

International Classification: H05K 7/02 (20060101)

Expiration Date: 8/08/02018