Patent Number: 7,100,278

Title: Component mounting apparatus and method

Abstract: A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.

Inventors: Hata; Kanji (Katano, JP), Yoshida; Noriaki (Ikeda, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H05K 3/30 (20060101); B23P 19/00 (20060101)

Expiration Date: 9/05/02018