Patent Number: 7,100,681

Title: Heat dissipation device having heat pipe

Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.

Inventors: Wu; Yi-Qiang (Shenzhen, CN), Deng; Wei (Shenzhen, CN), Zhao; Liang-Hui (Shenzhen, CN), Deng; Gen-Ping (Shenzhen, CN)

Assignee: Foxconn Technology Co., Ltd.

International Classification: F28D 15/00 (20060101); H05K 7/20 (20060101)

Expiration Date: 9/05/02018