Patent Number: 7,101,254

Title: System and method for in-line metal profile measurement

Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

Inventors: Swedek; Boguslaw A (Cupertino, CA), Johansson; Nils (Los Gatos, CA), Wiswesser; Andreas Norbert (Mountain View, CA), Birang; Manoocher (Los Gatos, CA)

Assignee: Applied Materials, Inc.

International Classification: B24B 49/00 (20060101); B24B 1/00 (20060101)

Expiration Date: 9/05/02018