Patent Number: 7,101,271

Title: Polishing head and chemical mechanical polishing apparatus

Abstract: An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.

Inventors: Moon; Jin-Ok (Gyeonggi-Do, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: B24B 5/00 (20060101); B24B 41/06 (20060101); B24B 7/00 (20060101); B24B 1/00 (20060101)

Expiration Date: 9/05/02018