Patent Number: 7,101,734

Title: Flip chip substrate design

Abstract: A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially the same thickness as the die. The die is positioned within the cavity and is attached therein with a standard die attachment procedure.

Inventors: Granada; Honorio T. (Cebu, PH), Joshi; Rajeev (Cupertino, CA), Tangpuz; Connie (Lapulapu, PH)

Assignee: Fairchild Semiconductor Corporation

International Classification: H01L 21/44 (20060101)

Expiration Date: 9/05/02018