Patent Number: 7,101,771

Title: Spin coating for maximum fill characteristic yielding a planarized thin film surface

Abstract: A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.

Inventors: Whitman; John (Boise, ID), Davlin; John (Nampa, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/31 (20060101)

Expiration Date: 9/05/02018