Patent Number: 7,102,218

Title: Semiconductor package with chip supporting structure

Abstract: A semiconductor package with a chip supporting structure is provided, including a lead frame having a die pad and a plurality of leads, and a plurality of chip supporting members mounted on the die pad. Each of the chip supporting members has a first surface and an opposing second surface and has an identical height. After the second surfaces of the chip supporting members are attached to the die pad, the first surfaces of the chip supporting members are coplanarly arranged, and a chip is mounted on the first surfaces of the chip supporting members, making the chip supporting members interposed between the chip and die pad. A molding resin for encapsulating the chip is allowed to penetrate through and fill into gaps between the chip and die pad, so as to prevent void formation and assure quality of fabricated products.

Inventors: Huang; Jung-Pin (Taichung, TW), Chang; Chin-Thuang (Taichung, TW), Chiu; Chin-Tien (Taichung, TW)

Assignee: Siliconware Precision Industries Co., Ltd.

International Classification: H01L 23/02 (20060101); H01L 27/06 (20060101); H01L 21/44 (20060101)

Expiration Date: 9/05/02018