Patent Number: 7,102,220

Title: Multiple cavity/compartment package

Abstract: A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.

Inventors: Stevens; Daniel S (Stratham, NH), Mink; Jeffrey T (Merrimack, NH)

Assignee: Delaware Capital Formation, Inc.

International Classification: H01L 23/02 (20060101)

Expiration Date: 9/05/02018