Patent Number: 7,102,226

Title: Device and method for package warp compensation in an integrated heat spreader

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Inventors: Fitzgerald; Thomas J. (Phoenix, AZ), Deppisch; Carl L. (Phoenix, AZ), Hua; Fay (San Jose, CA)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101)

Expiration Date: 9/05/02018