Patent Number: 7,102,367

Title: Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Abstract: A probe card includes probes, a build-up interconnection layer having a multilayer interconnection structure therein and carrying the probes on a top surface in electrical connection with the multilayer interconnection structure, and a capacitor provided on the build-up interconnection layer in electrical connection with one of the probes via the multilayer interconnection structure, wherein the multilayer interconnection structure includes an inner via-contact in the vicinity of the probe and the capacitor is embedded in a resin insulation layer constituting the build-up layer.

Inventors: Yamagishi; Yasuo (Kawasaki, JP), Shioga; Takeshi (Kawasaki, JP), Baniecki; John David (Kawasaki, JP), Kurihara; Kazuaki (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: G01R 31/02 (20060101); G01R 31/26 (20060101); H01L 29/08 (20060101); H01R 13/00 (20060101)

Expiration Date: 9/05/02018