Patent Number: 7,102,372

Title: Apparatus and method for testing conductive bumps

Abstract: Apparatus and method for testing conductive bumps. The apparatus for testing a plurality of conductive bumps with a single electrical pathway comprises a support substrate and a first probe, a second probe and a plurality of dual-probe sets respectively disposed in the support substrate, wherein each of the dual-probe sets comprises two electrically connected third probes.

Inventors: Kuo; Yian-Liang (Hsinchu, TW)

Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.

International Classification: G01R 31/02 (20060101)

Expiration Date: 9/05/02018