Patent Number: 7,102,905

Title: Stacked memory, memory module and memory system

Abstract: A point-to-point bus and a daisy chain bus are provided for supplying signals to stacked memories, and the stacked memories are mounted mutually apart by a distance equivalent to the length of the stacked memory on both surfaces of a module substrate. Furthermore, the memory chips arranged in a stacked memory mounted on one surface are set in an active state at the same time alternately with the memory chips arranged in a stacked memory mounted on another surface of the module substrate.

Inventors: Funaba; Seiji (Chuo-ku, JP), Nishio; Yoji (Chuo-ku, JP)

Assignee: Elpida Memory, Inc.

International Classification: G11C 5/02 (20060101); G11C 7/00 (20060101)

Expiration Date: 9/05/02018