Patent Number: 7,103,059

Title: Scalable 2-stage interconnections

Abstract: Modifications to the 2-stage interconnection to allow flexible scalability. Different switching fabrics having a range of different sizes can be constructed out of the same set of I/O switching nodes through this modified 2-statge interconnection, which can further be recursively invoked to construct large switching fabrics with desirable sizes. The recursive construction incorporating the modified 2-stage interconnection can seamlessly be realized through the five hierarchical levels of physical implementation, including inside-chip implementation, PCB implementation, orthogonal packaging, interface-board packaging and fiber-array packaging. The routability of the resulting switching fabric is always guaranteed and self-routing mechanism is also pertained.

Inventors: Li; Shuo-Yen Robert (Shatin, HK), Chiang; Lu Wa (Hong Kong, CN), Zhu; Jian (Shenzhen, CN)

Assignee: Industrial Technology Research Institute

International Classification: H04L 12/56 (20060101)

Expiration Date: 9/05/02018