Patent Number: 7,103,753

Title: Backplane system having high-density electrical connectors

Abstract: A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

Inventors: Crane, Jr.; Stanford W. (Boca Raton, FL)

Assignee: Silicon Bandwith Inc.

International Classification: G06F 15/00 (20060101)

Expiration Date: 9/05/02018