Patent Number: 7,131,194

Title: Method of manufacturing a device

Abstract: Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.

Inventors: Hashimoto; Takashi (Chino, JP)

Assignee: Seiko Epson Corporation

International Classification: H05K 3/30 (20060101)

Expiration Date: 2019-11-07 0:00:00