Patent Number: 7,131,486

Title: Electroosmotic microchannel cooling system

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Inventors: Goodson; Kenneth E. (Belmont, CA), Chen; Chuan-Hua (Stanford, CA), Huber; David E. (Mountain View, CA), Jiang; Linan (Menlo Park, CA), Kenny; Thomas W. (San Carlos, CA), Koo; Jae-Mo (Stanford, CA), Laser; Daniel J. (San Francisco, CA), Mikkelsen; James C. (Los Altos, CA), Santiago; Juan G. (Fremont, CA), Wang; Evelyn Ning-Yi (Stanford, CA), Zeng; Shulin (Sunnyvale, CA), Zhang; Lian (Sunnyvale, CA)

Assignee: The Board of Trustees of the Leland Stanford Junior Universty

International Classification: F28F 7/00 (20060101)

Expiration Date: 2019-11-07 0:00:00