Patent Number: 7,132,132

Title: Method of forming a fluid ejection device with a compressive alpha-tantalum layer

Abstract: A method of forming a fluid ejection device is disclosed. The steps of forming the fluid ejection device may include forming a heating element on a substrate. The steps for forming the fluid ejection device may further include depositing a buffer layer over the heating element, and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer.

Inventors: Fartash; Arjang (Corvallis, OR)

Assignee: Hewlett-Packard Development Company, L.P.

International Classification: B05D 5/12 (20060101)

Expiration Date: 2019-11-07 0:00:00