Patent Number: 7,132,158

Title: Support layer for thin copper foil

Abstract: A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the support layer, the release layer disposed between and contacting both the support layer and the metal foil layer. A reactive element containing layer, which may be the support layer, effective to react with gaseous elements or compounds to form thermally stable compounds contacts the release layer. The composite material is preferably subjected to a low temperature heat treatment. The combination of the low temperature heat treatment and the reactive element containing layer results in reduced defects including blisters in the copper foil during subsequent processing.

Inventors: Brenneman; William L. (Cheshire, CT), Chen; Szuchain F. (Hamden, CT)

Assignee: Olin Corporation

International Classification: B32B 15/01 (20060101); B32B 15/04 (20060101); B32B 15/20 (20060101)

Expiration Date: 2019-11-07 0:00:00