Patent Number: 7,132,214

Title: Polymers and photoresist compositions for short wavelength imaging

Abstract: This invention relates to resins and photoresist compositions that comprise such resins. This invention includes new resins that comprise photoacid-labile deblocking groups, wherein the acid-labile moiety is substituted with one or more electron-withdrawing groups. Polymers of the invention are particularly useful as a resin binder component of chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-300 nm and sub-200 nm and preferably about 157 nm. In such short-wavelength imaging applications resins of the invention exhibit decreased absorbance of short wavelength exposure radiation, such as sub-170 nm radiation e.g. 157 nm.

Inventors: Taylor; Gary N. (Northboro, MA), Brainard; Robert L. (Wayland, MA), Yamada; Shintaro (Marlborough, MA)

Assignee: Shipley Company, L.L.C.

International Classification: G03F 7/039 (20060101)

Expiration Date: 2019-11-07 0:00:00