Patent Number: 7,132,313

Title: Diamond heat spreading and cooling technique for integrated circuits

Abstract: A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

Inventors: O'Connor; Michael (Cupertino, CA), Haley; Kevin J. (San Jose, CA), Sur; Biswajit (San Jose, CA)

Assignee: Intel Corporation

International Classification: H01L 21/50 (20060101); H01L 21/00 (20060101)

Expiration Date: 2019-11-07 0:00:00