Patent Number: 7,132,737

Title: Package for electronic component and method of manufacturing piezoelectric device

Abstract: Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pattern. In the lower surface of a package body, there can be formed external terminals at the four corners thereof. The external terminals are bonded to a mounting board. The external terminals are electrically connected to the mounting electrodes, respectively. The external terminal is not connected electrically to either of the mounting electrodes. Therefore, positions of the external terminals for operating the piezoelectric resonator can be changed based on whether a pair of connecting electrodes of the piezoelectric vibration element is bonded to the mounting electrodes, or it is connected to the mounting electrodes. Accordingly, it can be possible to easily change positions of external terminals for connecting to a circuit on a board.

Inventors: Miyazaki; Katsuhiko (Minowa-machi, JP)

Assignee: Seiko Epson Corporation

International Classification: H01L 23/02 (20060101)

Expiration Date: 2019-11-07 0:00:00