Patent Number: 7,132,754

Title: Flip chip stack

Abstract: A flip chip stack of integrated circuits for minimum volume packaging with interconnected chips attached to one or two sides of a flexible circuit board where stacking arrangements for two, five and six chips are disclosed.

Inventors: Schmidt; Siegmar (Simi Valley, CA)

Assignee: Alfred E. Mann Foundation for Scientific Research

International Classification: H01L 23/28 (20060101)

Expiration Date: 2019-11-07 0:00:00