Patent Number: 7,133,288

Title: Processor heat sink retention module and assembly

Abstract: A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.

Inventors: DelPrete; Stephen Damian (Rehoboth, MA), Amaral, Jr.; Donald Phillip (Seekonk, MA)

Assignee: Tyco Electronics Corporation

International Classification: H05K 7/20 (20060101); H01L 31/024 (20060101)

Expiration Date: 2019-11-07 0:00:00