Patent Number: 7,134,187

Title: Method for making an inkjet-head chip structure

Abstract: A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.

Inventors: Liu; Chien-Hung (Hsinchu, TW), Liou; Jian-Chiun (Hsinchu, TW), Huang; Chi-Ming (Hsinchu, TW), Chiao; Chia-Cheng (Hsinchu, TW), Chen; Chun-Jung (Hsinchu, TW)

Assignee: Industrial Technology Research Institute

International Classification: H05B 3/00 (20060101)

Expiration Date: 2019-11-14 0:00:00