Patent Number: 7,134,193

Title: Method for manufacturing a wiring board

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Inventors: Sasaoka; Kenji (Zama, JP), Ikegaya; Fumitoshi (Ebina, JP), Mori; Takahiro (Kawasaki, JP), Motomura; Tomohisa (Inagi, JP), Sato; Yoshizumi (Yokohama, JP), Shibayama; Koichiro (Kuwana, JP)

Assignee: Dai Nippon Printing Co., Ltd.

International Classification: H01R 43/00 (20060101)

Expiration Date: 2019-11-14 0:00:00