Patent Number: 7,201,304

Title: Multi-functional solder and articles made therewith, such as microelectronic components

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Inventors: Yamashita; Tsuyoshi (Wilmington, NC), Jiang; Tongbi (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: B23K 31/02 (20060101); B23K 35/34 (20060101)

Expiration Date: 2019-04-10 0:00:00