Patent Number: 7,201,328

Title: Semiconductor devices and manufacturing method therefor and electric commerce method and transponder reader

Abstract: A wireless IC tag is provided which includes a plate-shaped first conductor, a plate-shaped second conductor, and an IC chip which is sandwiched between the first conductor and the second conductor via a front surface and a rear surface of the IC chip. The IC chip includes a double voltage rectifier circuit to rectify an alternating voltage induced between the front surface and the rear surface of the IC chip. The second conductor functions as an antenna and also includes a slit extending from a center portion thereof in a longitudinal direction. The first conductor electrically connects both sides of the slit via the front surface and the rear surface of the IC chip.

Inventors: Usami; Mitsuo (Tachikawa, JP), Sato; Akira (Fuchu, JP)

Assignee: Hitachi, Ltd.

International Classification: G06K 19/06 (20060101)

Expiration Date: 2019-04-10 0:00:00