Patent Number: 7,201,521

Title: Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

Abstract: An optoelectronic package includes an insulating base and an optoelectronic device mounted on the upper surface of the insulating base. A metal layer is attached to the upper surface of the insulating base, and a metal cap is attached to the metal layer to hermetically seal the metal cap to the insulating base. In one embodiment, the metal cap is projection welded to the metal layer.

Inventors: Zheng; Tieyu (Chandler, AZ)

Assignee: Intel Corporation

International Classification: G02B 6/42 (20060101)

Expiration Date: 2019-04-10 0:00:00