Patent Number: 7,201,636

Title: Chemical mechanical polishing a substrate having a filler layer and a stop layer

Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.

Inventors: Jin; Raymond R. (San Jose, CA), Li; Shijian (San Jose, CA), Redeker; Fred C. (Fremont, CA), Osterheld; Thomas H. (Mountain View, CA)

Assignee: Applied Materials, Inc.

International Classification: B24B 49/00 (20060101); B24B 1/00 (20060101)

Expiration Date: 2019-04-10 0:00:00