Patent Number: 7,202,111

Title: Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device

Abstract: A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.

Inventors: Chiu; Chia-Pin (Tempe, AZ)

Assignee: Intel Corporation

International Classification: H01L 21/44 (20060101); H01L 21/48 (20060101); H01L 21/50 (20060101)

Expiration Date: 2019-04-10 0:00:00