Patent Number: 7,232,766

Title: System and method for surface reduction, passivation, corrosion prevention and activation of copper surface

Abstract: A system and method of passivating an exposed conductive material includes placing a substrate in a process chamber and injecting a hydrogen species into the process chamber. A hydrogen species plasma is formed in the process chamber. A surface layer species is reduced from a top surface of the substrate is reduced. The reduced surface layer species are purged from the process chamber.

Inventors: Bailey, III; Andrew D. (Pleasanton, CA), Lohokare; Shrikant P. (Fremont, CA)

Assignee: Lam Research Corporation

International Classification: H01L 21/302 (20060101)

Expiration Date: 2019-06-19 0:00:00