Patent Number: 7,233,068

Title: Filling small dimension vias using supercritical carbon dioxide

Abstract: Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.

Inventors: Ramachandrarao; Vijayakumar S. (Hillsboro, OR), Turkot, Jr.; Robert B. (Hillsboro, OR)

Assignee: Intel Corporation

International Classification: H01L 23/48 (20060101); H01L 23/52 (20060101); H01L 29/40 (20060101)

Expiration Date: 2019-06-19 0:00:00