Patent Number: 7,272,001

Title: External conductive heat dissipating device for microcomputers

Abstract: A conductive heat dissipating device for microcomputers includes a motherboard having an opening and a first electric connector installed adjacent to the front side of the opening, an adapter board having a second electric connector connected to the first electric connector on the front side of the opening, a processor soldered at the back of the adapter board or a third electric connector for inserting a processor, such that the processor is placed upside down into the opening, and a heat dissipating board connected to the back of the motherboard and in contact with the surface of the processor, and the heat dissipating board is in contact with a special heat dissipating structure in a chassis to define an external conductive heat dissipating device capable of dissipating the heat to the outside, reducing the size of the microcomputer, shortening the distance of thermal conduction, and improving the heat dissipation.

Inventors: Cheng; Wan Chen (Taipei, TW)

Assignee: King Young Technology Co., Ltd.

International Classification: H05K 7/20 (20060101); G06F 1/20 (20060101)

Expiration Date: 2019-09-18 0:00:00