Patent Number: 7,272,010

Title: Thermally conductive integrated circuit mounting structures

Abstract: Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.

Inventors: Santana, Jr.; Miguel (Buda, TX), Bruce; Michael (Austin, TX), Chu; Thomas (Austin, TX), Goruganthu; Rama R. (Austin, TX), Powell; Robert (Austin, TX)

Assignee: Advanced Micro Devices, Inc.

International Classification: H05K 7/20 (20060101)

Expiration Date: 2019-09-18 0:00:00