Patent Number: 7,355,277

Title: Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package

Abstract: A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.

Inventors: Myers; Alan M. (Menlo Park, CA), List; R. Scott (Beaverton, OR), Vandentop; Gilroy J. (Tempe, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101)

Expiration Date: 2020-04-08 0:00:00