Patent Number: 7,355,285

Title: Structure of mounting electronic component

Abstract: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

Inventors: Kobae; Kenji (Kawasaki, JP), Kira; Hidehiko (Kawasaki, JP), Kainuma; Norio (Kawasaki, JP), Matsumura; Takayoshi (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: H01L 23/48 (20060101)

Expiration Date: 2020-04-08 0:00:00